| 摘要 |
Printed circuit board, provided with conductive pattern on one side or both sides of the board and through-holes, has conductive materials being inserted in its through-holes, the conductive material being metallically connected with the conductive pattern. The printed circuit board is manufactured in such a manner that by inserting conductive material to the through-hole, bending end portion of the conductive material laterally toward conductive pattern, applying ultrasonic welding to the bent end portion of the conductive pattern so as to make the end portion metallically connected to the conductive pattern. |
