| 摘要 |
PURPOSE:To easily improve the characteristic of a device having an elastic surface wave element which requires an electrode of specially minute width, by arranging chips made of different materials on a plane through the intermediary of an insulating connection part, and by providing metal wirings on the continuous surfaces of the chips. CONSTITUTION:Chips A and B are arranged horizontally on a vacuum chuck 13 made of fluorocarbon resin and having a smooth surface, with their surfaces, whereon electrodes are formed, on the lower side and with a gap 14 between them. The chips are sucked up by the chuck under vacuum, epoxy resin is filled up in the gap 14 and subjected to a setting process, and thereby an insulating connection part 9 is formed. The chips A and B thus incorporated in one body are removed from the chuck 13 and arranged on a package substrate 3 being an insulator whereon a metal plate or an electroconductive layer is formed, with the back surfaces of the chips A and B coated with an insulating bonding agent 10 and an electroconductive bonding agent 11, respectively. Then a desired setting process is applied thereto. The combination of the bonding agents is selected properly in accordance with the materials and structures of the chips A and B. Next, a metal is connected thereto and a wiring 12, an electrode 6, etc. are attached thereto. Since the wiring is not present in a space between the chips, the increase in the capacity of leads and in a feedthrough is prevented, and the high-frequencey characteristic of the device is maintained. |
