发明名称 MANUFACTURE OF HEAT SINK FOR CERAMIC SUBSTRATE OF ELECTRONIC COMPONENT
摘要 PURPOSE:To obtain a heat sink which is light and excellent in heat radiation by bonding covers under compression to a tubular body molded out of paste of powder of ceramic, sintering them into one body, enclosing a working liquid therein, and providing later a metallized layer on the surface of one cover. CONSTITUTION:A prescribed amount of a binding agent and a plasticizer are added to Al2O3, SiO2 and MgO, a mixture thus prepared is kneaded and molded by extrusion into a long tube having cavities with many capillary grooves 3 formed in the longitudinal direction of inside walls thereof, and a tubular body 1 is prepared by cutting the tube. Meanwhile, cover 4 and 5 are prepared by punching boards made of the same material, the inside surfaces thereof are coated with paste of powder of a prescribed component ratio of Al2O3, SiO2 and MgO which form porous sintered layers 7 at a sintering temperature, the covers 4 and 5 thus prepared are bonded under heat and compression to the tubular body 1, and they are sintered into one body. A metallized layer 9 is applied onto the top surface of a container thus prepared, a working liquid such as water is injected into the inside of the sintered body through a pipe 8 provided at the tubular body or the cover, and later the pipe 8 is stopped up. A heat sink prepared in this way is excellent in heat radiation, and it is also excellent in its bonding property, since it has the metallized layer 9.
申请公布号 JPS5825248(A) 申请公布日期 1983.02.15
申请号 JP19820121539 申请日期 1982.07.12
申请人 NIPPON TOKUSHU TOGYO KK 发明人 FUKUURA TAKETO
分类号 H01L23/373;H01L21/48 主分类号 H01L23/373
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