发明名称 |
PACKAGE FOR ELECTRONIC DEVICE |
摘要 |
An electrical device package comprising an open ended container and an enclosure defining a cavity in which an electrical device is contained. The enclosure is positioned in the container and is sealed therein by a filling of moulding material. The package is particularly suitable for containing surface acoustic wave devices e.g. filters where contact with the moulding material during and after packaging must be avoided. |
申请公布号 |
JPS5825246(A) |
申请公布日期 |
1983.02.15 |
申请号 |
JP19820080839 |
申请日期 |
1982.05.13 |
申请人 |
PURETSUSHII OOBAASHIIZU LTD |
发明人 |
SUCHIIBUN KENESU AACHIYAA |
分类号 |
H01L23/02;H01L23/24;H01L23/31;H03H9/00;H05K5/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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