| 摘要 |
An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again. The stack of matrices is then heated, its orifices filled with a quantity of heated, liquid thermosetting encapsulating compound and exposed to vacuum whereby substantially all air is drawn from the molding cavities through the liquid encapsulating compound. The stack is then again exposed to atmospheric pressure forcing the encapsulating compound throughout the unoccupied voids in the molding cavities after which that compound is permitted to solidify, thereby completing the encapsulation process.
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