| 摘要 |
PURPOSE:To evade the occurrence of inferior products by a method wherein two or more checking devices are mechanically constructed in one, each of which is connected to a computer that analyzes the cause for the inferior products, then based on this cause, the preceding process of semiconductor manufacturing system is automatically controlled. CONSTITUTION:A magazine 7 that stores a number of wafers 4 at the lower stream of the thin film forming process 3 is installed, therefrom wafers 4 are transferred one by one by a transport track 8 to a foreign matter checking device 1 that consists of a sample bed 5, an optical system 6 and an XY table 9. Next, the checked wafer 4 is sent by a track 12 to a film thickness checking device 2 which consists of a sample bed 10 and a film thickness measuring device 11, being stored in a magazine after its film thickness checked. Then a signal from the optical system 6 and the measuring device 11 is stored into a magnetic memory 17. A computer 18 reads out this signal, analyzes the existence of a foreign matter or inferior film thickness by comparing the signal with a designated program, and stops the preceding process to the process 3. |
