发明名称 Method of manufacturing a semiconductor device
摘要 An undoped polycrystalline silicon layer 6 is provided on an electrically insulating layer 2 at the surface 8 of a semiconductor body 1 and a metal layer 4, for example of molybdenum, is provided on layer 6. After heating to convert part of layer 3 into a metal silicide layer 5 a dopant, for example phosphorus, is introduced into the polycrystalline layer 4 through layer 5. This method can be used to make an insulated gate field effect device where the gate comprises a double layer structure of metal silicide on polycrystalline silicon.
申请公布号 US4373251(A) 申请公布日期 1983.02.15
申请号 US19810294268 申请日期 1981.08.19
申请人 U.S. PHILIPS CORPORATION 发明人 WILTING, HERMANUS J. H.
分类号 H01L29/78;H01L21/28;H01L21/3205;H01L23/52;H01L29/423;H01L29/43;H01L29/49;(IPC1-7):H01L21/22 主分类号 H01L29/78
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