Method of and device for positioning electrical and or electronic components on a substrate.

摘要

A method of and a device for the mounting of electrical and/or electronic components on a substrate. The components (5) are presented at a pick-up position in a fixed, invariable pattern, preferably in a row, are simultaneously picked up in this pattern by a number of transfer devices (21), are simultaneously moved to their mounting positions over the substrate (1). During this transfer they are moved into a modified pattern with respect to one another which deviates from the fixed pattern and which corresponds to the desired pattern in which the components are to be positioned on the substrate. The transfer devices are programmed by means of exchangeable program plates (71).