| 发明名称 |
ALL METAL FLAT PACKAGE FOR MICROCIRCUITS |
| 摘要 |
An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics. |
| 申请公布号 |
GB2032188(B) |
申请公布日期 |
1983.02.09 |
| 申请号 |
GB19790031620 |
申请日期 |
1979.09.12 |
| 申请人 |
ISOTRONICS INC |
发明人 |
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| 分类号 |
H01L21/50;H01L23/047;(IPC1-7):05K5/04;05K7/20 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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