| 摘要 |
This invention is a means for assembling an electrical component in a casing (28) which in use generates enough heat to require a heat sink (26) on a printed circuit board (10). The casing (28) is mounted on studs (20) swaged into the base of the heat sink (26) and having projecting heads (25) which are tinned and fit in holes (35) in the board (10) so that the exposed ends can be soldered to the printed conductive pattern to hold the heat sink and component assembled with the board. |
