SEMICONDUCTOR COMPONENT AND METHOD OF ITS PRODUCTION

摘要

A semiconductor p-n junction device having a monocrystalline body, preferably of silicon, is equipped with connector leads which are punched out of sheet material and are soldered to the electrodes of the device. Each connector lead has at least one springy clamping lug protruding toward the other connector lead and located beside a clamping lug of another connector lead. The semiconductor body is clamped between the lugs of two superpositioned adjacent connector leads and is soldered thereto.