发明名称 |
Method for manufacturing solderable, temperable, thin film tracks which do not contain precious metal |
摘要 |
A method for manufacturing solderable, temperable thin film tracks which do not contain precious metal on an electrically non-conductive substrate serving as a carrier employs the steps of applying an adhesive or resistance layer to the substrate, which serves as an intermediate layer, applying a conductive layer over the intermediate layer, and applying a protective anti-corrosion layer over the conductive layer. The protective layer may consist of aluminum or an aluminum alloy, or may be comprised of a combination of a layer of aluminum and a layer of chrome. An aluminum layer may also be applied between the intermediate layer and the conductive layer.
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申请公布号 |
US4372809(A) |
申请公布日期 |
1983.02.08 |
申请号 |
US19820346100 |
申请日期 |
1982.02.05 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GREWAL, VIRINDER;REINDL, WERNER |
分类号 |
H05K3/34;H01L27/01;H05K1/16;H05K3/06;H05K3/24;(IPC1-7):C23F1/02;B05D5/12 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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