| 摘要 |
PURPOSE:To improve durability against corrosion and wire breakage accompanied with penetration of moisture by a device wherein the entire opening portion of a protective film for the semiconductor device is coated with a material of the bonding wire. CONSTITUTION:A connecting portion 4 between a bonding wire 3 and a bonding pad 5 is made larger than an opening portion 2 in a protective film 1. Since the entire opening portion 2 is covered with the connecting portion 4, the bonding pad 5 is entirely covered with the protective film or the connecting portion 4 with the same material as the bonding wire. Thus, moisture having penetrated from the exterior will not come into contact with the bonding pad 5. In case of a mold resin package, a main component of the bonding pad 5 is Al, so it tends to be corroded. Meanwhile, a main component of the bonding wire 3 is gold, so it is hard to corrode. Thus, the bonding pad 5 can be protected from corrosion by covering the opening portion 2 in the bonding pad 5 formed of Al with the bonding wire 3, thereby preventing wire breakage. |
