| 摘要 |
PURPOSE:To reduce the inductance of input and common terminals and contrive an operating stability, by opposingly providing two metallized layers with a part of a U-shaped metallized layer whereon semiconductor elements are adhered placed therebetween and forming the U-shaped metallized layer into an output terminal. CONSTITUTION:The metallized layer 4 in a U-shape for the output terminal is provided on a ceramic substrate 1, and the output terminal 6 is connected to both ends. The metallized layers for the common therminal 2 and the input terminal 5 are opposingly arranged with one side of the layer 4 placed therebetween, and one end of the common terminal 2 is connected to the entire surface metallized layer on the back surface of the substrate 1 via the metallized layer 13 on the side surface of the substrate 1. The input terminal 7 is connected to the layer 5. Then, the device is completed by connecting 9, 10 to the semiconductor element 8. In this constitution, the inductance of the common terminal can be reduced in a good balance, the connecting wire 10 is shortened, and a power gain with high stability in a high frequency region is obtained. |
