摘要 |
PURPOSE:To make the pressure of a resin constant and appropriate for an automatic sealing device by a method wherein many rubber materials with built- in semiconductor devices are respectively contained in cavities of lower metal mold for sealing, resin material pellets are supplied, simultaneously an upper metal mold having independent many plungers on the lower surface is pressed on, and heating is performed simultaneously resulting in collective sealing. CONSTITUTION:Many rubber materials 5 with built-in semiconductor devices are contained in a magazine stocker 19 in multi-superposition, and drawn out from the upper stage in order by a lead-out pin 22 and a chucking device 25 being mounted on a pre-heat rail 23 with a built-in heater 24. Next, this rail 23 is moved to the lower metal mold 17 with a built-in heater 24', the rubber materials 5 are dropped one by one into independent cavities provided on the metal mold 17, and resin pellets 18 stored in a hopper 35 are supplied thereinto via a supply block 39. Thereafter, a molding cylinder 30 having many plungers 9 on the lower surface is pressed down, and a fixed resin sealing is performed by contacting each plunger onto independent cavities. |