| 摘要 |
PURPOSE:To mass-produce the semiconductor devices by collectively molding a plurality of the semiconductor devices through simple work such as immersion without using a carbon jig involving complicated work. CONSTITUTION:Structures 8 formed by brazing electrode plates 7 to both surfaces of semiconductor elements 6 are fast stuck through spacers 9, and arranged in a straight line, and protective plates 10 are applied to both ends and pushed. The whole is immersed in epoxy resin and turned, and sheathed through curing. When the protective plates 10 are removed and the elements are separated at the sections of the spacers 9, the semiconductor devices 12 are completed, and can be mass-produced. |
