发明名称 MANUFACTURE OF SEMICONDUCTOR PRESSURE TRANSDUCER
摘要 PURPOSE:To fix a semiconductor substrate or a base board excellently while preventing the generation of stress concentration in the fixing surfaces of the substrate or the base board by previously forming a groove to either one of the fixing surfaces along a dicing line. CONSTITUTION:Through-holes 5A are formed at the centers of sections isolated through the post-process of the base board body 5 and the grooves 5B along the dicing lines. A pressure sensitive element 6 is shaped integrally to the semiconductor substrate, and has diaphragm sections 6A and supporting sections 6B in a surface opposed to the base 5, and the sections 6A are arranged while being opposed to each through-hole 5A. Gage resistors 12 and electrodes 13 are formed to the surfaces of the diaphragms 6A. The pressure sensitive element 6 to which the dicing base 5 is fixed along the lines D is acquired. According to this constitution, even when the substrate is slightly warped or the supporting sections 5B are displaced from predetermined positions and fixed and concentrated stress is generated when the semiconductor substrate is fastened, the stress can be absorbed by the sections not fixed of the grooves 5A, and the characteristics of the pressure sensitive element 6 are not affected adversely.
申请公布号 JPS5821380(A) 申请公布日期 1983.02.08
申请号 JP19810117720 申请日期 1981.07.29
申请人 HITACHI SEISAKUSHO KK 发明人 TAKAHASHI MINORU;MINORIKAWA HITOSHI;ARAKAWA NORIYOSHI
分类号 G01L9/04;G01L9/00;H01L29/84 主分类号 G01L9/04
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