摘要 |
PURPOSE:To avoid contamination of semiconductors by an apparatus wherein the torch direction of a torch burner is made non-parallel to the feeding direction of a lead frame, so that semiconductor elements are not present in the scattering direction of fused pieces of the wire at the time of wire bonding. CONSTITUTION:The drive center of a torch burner 8 is positioned to be sidewardly shifted from a line (the prior drive center) connecting plural semiconductor elements on a lead frame 2. The torch burner 8 is rotatable in a plane, and the torch is actuated to fuse and cut a wire in the direction B' as indicated by a two-dot chain line. The direction B' is non-parallel to the feeding direction C of the lead frame. Namely, both directions make an angle theta therebetween. As a result, since semiconductors are not present in the scattering direction of fused pieces of the wire at the time when the bonding wire is bonded, the semiconductor elements will not be contaminated. |