发明名称 SOCKET FOR IC DEVICE
摘要 PURPOSE:To obtain a socket free from poor contact due to wear by arranging a lead section, a guide cylinder and an electrode section integral with a conductive spring adapted to be electrically energized from the lead section in a plug-in type package. CONSTITUTION:A conductive guide cylinder 5 is provided on an insulated substrate 9 and has an electrode 6 and a spring section 7 made of metal or the like integral with the electrode. A lead 8 of an IC device is mounted on this socket. Under such a condition, the lead is kept in contact with the electrode by a spring force and the guide section is made up of a conductive material. This can eliminate shortcomings of the conventional socket. In addition, integral material of the electrode section and the spring prevents poor contact in the area.
申请公布号 JPS5821574(A) 申请公布日期 1983.02.08
申请号 JP19810121155 申请日期 1981.07.31
申请人 NIPPON DENKI KK 发明人 TAKAGI MINORU
分类号 G01R31/26;H01L21/66;H01L23/32;H01R33/945;H01R33/96;H05K7/12 主分类号 G01R31/26
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