发明名称 MOLDING METHOD FOR RESIN
摘要 PURPOSE:To obtain a resin molded article with high accuracy, by a method wherein a photosensitive resin in a thick plate form is exposed to light through a photo-mask placed in close contact with the resin or by projecting light thereon, is subjected to etching development, and the thus shaped article is used as a mold in which a predetermined resin is molded. CONSTITUTION:Numeral 1 denotes a photosensitive resin, and numeral 2 denotes the photo-mask, the parts of which faced to the part 3 to be left after etching is light-transmitting, while the other part 4 is opaque. The resin 1 is supported on a base plate 5. The resin is exposed to light through the photo-mask 2 placed in close contact with the resin 1 or by projecting light thereon. In this case, the light entering the resin 1 through the light-transmitting part 3 is gradually diffused in the interior of the resin 1 as indicated by broken lines. Then, development is conducted by etching away the resin part faced to the opaque part 4 of the photo-mask 2. A resin 7 is poured into the etched part 6 and is hardened. Accordingly, since the exposure through the photo-mask 2 and the development are highly accurate, it is possible to obtain a molded article with high accuracy.
申请公布号 JPS5820414(A) 申请公布日期 1983.02.05
申请号 JP19810119861 申请日期 1981.07.29
申请人 SHIMAZU SEISAKUSHO KK 发明人 YAMAMOTO MASAYUKI
分类号 B29B13/00;B29C33/00;B29C33/38;B29C33/40;B29C35/08 主分类号 B29B13/00
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