| 摘要 |
PURPOSE:To obtain a packaging material having a high bond strength between a metallized film and a substrate, by irradiating a heat-bondable resin film with electron beam at a low irradiation dose, subjecting the film with a corona discharge treatment, and forming a metallized film on the treated surface. CONSTITUTION:A heat-bondable resin film 2 such as a polyolefin film is irradiated with electron beam 3 at a low irradiation dose of, e.g., 1-5Mrad, and then subjected to a corona discharge treatment 4, for example, under conditions of 10-40w/m<2>/min to obtain a treated film 5. A metallized film 7 is formed on the surface of the film, for example, by vacuum-metallizing it with aluminum to produce a heat-bondable packaging material 8. There can be obtd, a heat-bondable packaging material which has a high bond strength between the metallized film and a sealant or the substrate and surely prevents the metallized film from becoming transparent or delaminated in a heat treatment such as boiling treatment of a packaging material composed of laminated substrate. |
