发明名称 |
Thin-structure aerial |
摘要 |
A thin-structure aerial is formed by means of a sheet of a dielectric substrate 1, whose rear surface is covered with a layer 2 of a conductive material and whose front surface has at least one radiating slot 4 formed in another layer 3 of a conductive material covering said substrate. Means 5are provided for simulating lateral walls surrounding at least one radiating slot. The aerial is characterized in that it is provided with at least one feed slot 10 which is formed in said layer of a conductive material covering the front surface and which is arranged parallel to and in the vicinity of the radiating slot.
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申请公布号 |
US4371877(A) |
申请公布日期 |
1983.02.01 |
申请号 |
US19810256349 |
申请日期 |
1981.04.22 |
申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
DOUSSOT, MICHEL;COURTOIS, CHRISTIAN |
分类号 |
H01Q13/10;(IPC1-7):H01Q13/10 |
主分类号 |
H01Q13/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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