发明名称 Thin-structure aerial
摘要 A thin-structure aerial is formed by means of a sheet of a dielectric substrate 1, whose rear surface is covered with a layer 2 of a conductive material and whose front surface has at least one radiating slot 4 formed in another layer 3 of a conductive material covering said substrate. Means 5are provided for simulating lateral walls surrounding at least one radiating slot. The aerial is characterized in that it is provided with at least one feed slot 10 which is formed in said layer of a conductive material covering the front surface and which is arranged parallel to and in the vicinity of the radiating slot.
申请公布号 US4371877(A) 申请公布日期 1983.02.01
申请号 US19810256349 申请日期 1981.04.22
申请人 U.S. PHILIPS CORPORATION 发明人 DOUSSOT, MICHEL;COURTOIS, CHRISTIAN
分类号 H01Q13/10;(IPC1-7):H01Q13/10 主分类号 H01Q13/10
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