发明名称 |
ELECTRONIC CIRCUIT ARRANGEMENT MOUNTED ON PRINTED CIRCUIT BOARD |
摘要 |
<p>In an electronic circuit arrangement in which leadless electronic circuit parts consisting of cylindrical bodies with electrodes attached to both-ends of the body are mounted on a printed circuit board with the electrodes of adjacent leadless electronic circuit parts are connected directly to each other through axially arranged solder rather than through a conductive pattern.</p> |
申请公布号 |
CA1140680(A) |
申请公布日期 |
1983.02.01 |
申请号 |
CA19790342057 |
申请日期 |
1979.12.17 |
申请人 |
SONY CORPORATION |
发明人 |
OHSAWA, MITSUO |
分类号 |
H01R12/00;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):05K1/16 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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