发明名称 ELECTRONIC CIRCUIT ARRANGEMENT MOUNTED ON PRINTED CIRCUIT BOARD
摘要 <p>In an electronic circuit arrangement in which leadless electronic circuit parts consisting of cylindrical bodies with electrodes attached to both-ends of the body are mounted on a printed circuit board with the electrodes of adjacent leadless electronic circuit parts are connected directly to each other through axially arranged solder rather than through a conductive pattern.</p>
申请公布号 CA1140680(A) 申请公布日期 1983.02.01
申请号 CA19790342057 申请日期 1979.12.17
申请人 SONY CORPORATION 发明人 OHSAWA, MITSUO
分类号 H01R12/00;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):05K1/16 主分类号 H01R12/00
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