发明名称 INJECTION MOLDING MACHINE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to stably mix main agent and catalyst at the stable ratio and to stably operate an injection molding machine without hardening a catalytic pipe by providing a drive unit moving in a main agent pipe to supply or stop the catalyst to the main agent. CONSTITUTION:Main agent is fed under pressure from a main agent pipe 8. Catalyst is led from a catalyst tank 7 through a catalyst pipe 12, a control valve 6 and a valve 5 to a filling pipe 22, and is filled to the main agent in a main agent pipe 8 through a hole 21. This filling is performed at the center of the pipe 8. The main agent mixed with the catalyst is fed to a mixer 3, is then mixed and is fed under pressure to a mold. when the mold is completely filled and the flow of the main agent is stopped, or when a long time working is not carried out, a movable plate 18 is moved by a drive unit 13, and the position of the injection port of the pipe 22 is disposed outside the pipe 8. In this manner, the catalyst can be completely isolated from the main agent.
申请公布号 JPS5817624(A) 申请公布日期 1983.02.01
申请号 JP19810116665 申请日期 1981.07.24
申请人 MITSUBISHI DENKI KK 发明人 YANAGIYA KOUJI
分类号 B29C45/00;B01F5/04;B29B7/28;B29B7/80;B29C39/00;B29C39/10;B29C39/24;B29C43/00;H01L21/56 主分类号 B29C45/00
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