发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PURPOSE:To facilitate coating of a release agent to the contacting surface between a mask and a semiconductor wafer by generating break away agent steam in an isolated air space inside the mask when a wafer chuck is moved out of a mask holder. CONSTITUTION:A semiconductor wafer 1 is advanced into a mask holder 7 by means of a wafer chuck 6 and brought into contact with a mask 5. Then, the semiconductor wafer 1 is removed from the mask 5 with the wafer chuck 6 and moved out of the mask holder. Then an air space A inside the mask 5 is isolated from the outside by an isolating member 14 and the air space A is filled with release agent steam from a release agent steam generator 27, and the mask 5 is then coated with a release agent 28.
申请公布号 JPS5816530(A) 申请公布日期 1983.01.31
申请号 JP19810115820 申请日期 1981.07.22
申请人 SHIN NIPPON DENKI KK 发明人 NAKAJIMA MASAHIRO;YAMAMOTO KIICHIROU
分类号 H01L21/027;G03F7/20;H01L21/00 主分类号 H01L21/027
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