| 摘要 |
PURPOSE:To improve the sealability and the electric characteristics of an integrated circuit by coating an adhesive on the sealed part of a hollow package and then defoaming it under reduced pressure. CONSTITUTION:A substrate 3 and a cover 4 formed of synthetic resin are bonded with a liquid epoxy resin adhesive 5 at an ambient temperature, and a transistor chip 1 is sealed in the hollow package. Then, a hollow package is stationarily placed in a pressure resistant container, which is evacuated via a vacuum pump to be reduced to 150mm.Hg. Then, the operations to return to the normal pressure are repeated twice, thereby defoaming the adhesive. |
