| 摘要 |
PURPOSE:To obtain a sealing agent for a semiconductor package having sufficient sealability even if heat shock is applied by employing as main materials inorganic filler, epoxy resin and amine series hardener. CONSTITUTION:A sealing agent is formed of epoxy resin which contains 30- 70vol% of inorganic filler and an amine series hardener. The filler includes alpha- quartz glass, molten silica, oxidized aluminum, boron nitride, hydroxided aluminum, or oxidized magnesium, preferably molten silica or oxidized aluminum. The grain size of the filler is less than 100mum, particularly preferably less than 50mum. The sealing agent of this invention is used for the bonding of a semiconductor package which is formed of ceramic and glass, copper or aluminum substrate and ceramic or thermosetting resin, ceramic or thermosetting resin and lead wire. |
