| 摘要 |
<p>PURPOSE:To avoid heating of high temperature at the time of firing and thereby to obtain a uniform thick film resistance, by applying organic resin on the surface of the thick film resistance when an electrode and a wiring having prescribed patterns are formed on an insulation substrate by a thick film means and the thick film resistance is provided between them by means of printing of paste and firing. CONSTITUTION:Patterns 2 of an electrode and a wiring are formed on a ceramic substrate 1 by a thick film means, printing is made by using necessary paste, and a thick film resistance 3 is prepared in a region ranging from a part where the substrate 1 is exposed to the edge part of the pattern 2. Next, organic resin 4 is applied on a region ranging from the resistance 3 to the patterns 2 located at both end parts. Then it is cured and thereby a wiring substrate containing the thick film resistance is prepared. According to this constitution, the paste is not heated to a high temperature at the time of firing, and thus it becomes possible to obtain a required resistance value in a stable manner.</p> |
