| 摘要 |
<p>PURPOSE:To prevent discoloration due to the heat treatment applied when a semiconductor element is fixed on an eyelet, by applying die scalping to a wire rod with an Ni layer formed on the surface, and by using the same as an external connection terminal. CONSTITUTION:Ni plating 22 of 3-5 weight % is applied on the surface of a 42 alloy wire 21 having a diameter of 4mm., die scalping and annealing are then applied repeatedly, and thus a wire rod having Ni coating in the same quality with that of metal Ni is prepared. The rod is cut in a desired length and finished by heading processing. An external connection terminal prepared according to this constitution is not discolored when a semiconductor element is fixed on an eyelet, because of the presence of an Ni layer on the surface thereof. In addition, the rigidity of the wire rod is preserved and this facilitates the connection of the terminal to the eyelet by welding, since no heat treatment is conducted after final die scalping.</p> |
