| 摘要 |
A method for producing a hybrid circuit having a substrate (Su), conductor tracks (F1) which are deposited on the substrate (Su) and are in each case at least largely located between two contact spots (KF1, KF2) (bonding pads, bonding islands) which are conductively connected to the relevant conductor tracks (F1) and in each case represent fragments of turns of a magnet coil, and having a magnet coil (MK) which has an internal hole and is placed onto these fragments (F1) such that its magnetic field lines (lines of force) which enclose the inner hole in operation run largely parallel to the substrate surface in every case, and the first contact spots (KF1) are located inside the inner hole and the second contact spots (KF2) are located outside the magnet-core envelope, the remainder of the turns in each case being formed by sections (A), which are located over the magnet core (MK), of conductor tracks which are deposited on a carrier (Is2) as a metal layer, and these sections (A) of the conductor tracks being conductively connected at their one end (V, Ae) to a respectively associated first contact spot (KF1) and at their other end (V, Ae) to a respectively associated second contact spot (KF2). The production is simplified particularly in that the fragments (F1) and the contact spots (KF1, KF2) connected to them are formed on the substrate (Su), a cohesive structural unit (A/Is2)MK) is produced in another step, in the case of which the carrier (Is2) is located as insulation between the magnet core (MK) and the sections (A), the ends (V, Ae) of the sections (A) of the structural unit (A/Is2/MK) are subsequently separated by protective insulation (Is1), are placed onto or plugged onto the contact spots (KF1, KF2) of the fragments (F1), and the ends (V, Ae) of the sections are finally permanently and conductively connected to the associated contact spots (KF1, KF2). <IMAGE>
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