发明名称 |
INTEGRATED CIRCUIT CHIP CARRIER |
摘要 |
Known chip carriers are usually made of ceramic material which is expensive and can give rise to problems due to differential expansion when bonded to conventional epoxy/glass printed circuit board. …<??>The invention provides a chip carrier comprising a base (10) of plastics material and a side wall (22) of plastics material, extending around the periphery of the chip carrier so as to define a chip mounting cavity. Conductive tracks extend from first connecting points (12) in the cavity to second connecting points (18) on the periphery of the chip carrier. |
申请公布号 |
ZA8200368(B) |
申请公布日期 |
1983.01.26 |
申请号 |
ZA19820000368 |
申请日期 |
1982.01.20 |
申请人 |
BRITISH TELECOMMUNICATIONS |
发明人 |
SINNADURAI FRANCIS NIHAL;COOK ANTHONY JAMES;GURNETT KEITH WILLIAM |
分类号 |
H01L23/14;H01L23/498 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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