发明名称 JET TYPE SOLDER TANK
摘要 PURPOSE:To solder a necessary part surely by providing a flow direction changing part that reverses the direction of flow mutually on the upper outside of a nozzle installed in the body of a tank and thereby giving solder flow of four directions to the part. CONSTITUTION:Solder molten by a heater 26 and contained in the body of a tank 1 is sent by pressure to the lower part of a nozzle 13 by driving pump blades 7, and jetted from an opening 16 at the upper end of a nozzle 13. A printed circuit substrate 14 is carried obliquely to the nozzle 13 so that the lower face comes into contact with the upper face of the jetted solder. The solder jetted from the nozzle 13 is divided to both sides, and after flowing in the direction of arrows A and B, flows in the direction of arrows C and D along flow direction changing parts 18, 20. Consequently, a leadless part 27 adhered to the lower face of the printed circuit substrate 14 receives the flow of solder from four directions and from below, and a conducting part on the outside is soldered surely to the printed circuit substrate 14.
申请公布号 JPS5813471(A) 申请公布日期 1983.01.25
申请号 JP19810111287 申请日期 1981.07.16
申请人 TAMURA SEISAKUSHO:KK 发明人 MASUDA TSUGUNORI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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