发明名称 |
Encapsulation of electronic device |
摘要 |
An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.
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申请公布号 |
US4370292(A) |
申请公布日期 |
1983.01.25 |
申请号 |
US19810270233 |
申请日期 |
1981.06.04 |
申请人 |
ASAHI GLASS COMPANY, LTD. |
发明人 |
YANASE, HIROSHI;KANNO, FUKUO;ABE, TAKESHI |
分类号 |
B29C45/00;B29C35/00;B29C43/00;B29C45/02;B29C45/14;C08L61/04;C08L63/00;C08L71/00;C08L77/00;C08L81/00;C08L81/02;C08L83/04;C08L101/00;H01G2/12;H01L21/56;H01L23/29;H01L23/31;H05K5/06;(IPC1-7):B29C6/00 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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