发明名称 |
Through type high-withstand-voltage ceramic |
摘要 |
In elliptical shaped insulated high voltage ceramic capacitors, subjected to higher heat and temperature, stresses are formed which causes gaps between the insulation and ceramic capacitor. To solve this and other problems a hollow elliptical shaped plastic cover is positioned below the capacitor ground conductor. The cover has a bridge which separates the cross section of the cover into two substantially circular areas an insulator is injected into the cover which also covers the capacitor.
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申请公布号 |
US4370698(A) |
申请公布日期 |
1983.01.25 |
申请号 |
US19800177374 |
申请日期 |
1980.08.12 |
申请人 |
TDK ELECTRONICS CO., LTD. |
发明人 |
SASAKI, SETSUO |
分类号 |
H01G4/224;H01G4/35;(IPC1-7):H01G4/42 |
主分类号 |
H01G4/224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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