| 摘要 |
PURPOSE:To eliminate the sprinkle of molten metal shot due to the bumping of seal-solder material onto semiconductor elements by a method wherein the temperature of the seal solder material passes through the melting point at a low speed so as not to suddenly increase thereafter in a transistor, IC, etc. CONSTITUTION:The figure represents a soldering device whereon heating furnaces 12-1,-12-5 divided into five are respectively arranged around hermetic sealing tubes 11 having the passage of a belt 13 at the center. Each heating furnace can independently control the temperature. In this device, since the distribution of temperature in the furnaces can be controlled at five stages, when the melting point P of the seal solder material is 280 deg.C, the temperature rise speed on passing the temperature can be controlled to 15 deg.C/min. As the result, the generation of molten metal shot due to the bumping of the seal-solder material is eliminated, and hermetic inferiority is also eliminated. |
