| 摘要 |
PURPOSE:To reduce the cost of production of a protruded electrode as the solder or gold electrode of a semiconductor element and heighten the dimensional accuracy of the protruded electrode, by improving the efficiency of the production and reducing the labor for it. CONSTITUTION:A piston rod is moved forth at a delivery mechanism 301 so that a truck 201 receives a holder 13. The piston rod is then moved bck. When the truck 201 is moved to the position of each of the previous treatment vessel 101, cold water rinsing vessel 102, plating vessel 103 and hot water rinsing vessel 104 of a plating system 100 provided along rails 202, the holder 13 is moved forth toward the vessel and secured on it by a securing means provided for the vessel. The piston rod is then moved back. After treatment is finished at each vessel, the truck 201 is moved to the position of the vessel to receive the holder 13. The truck 201 is finally moved to the position of a reception mechanism 302 to transfer the plated holder 13 to the mechanism and then starts the next conveyance action. |
