发明名称 PHOTOSENSITIVE RESIN LAMINATED BODY FOR FORMING SOLID RELIEF MOLD
摘要 PURPOSE:To facilitate the uniform close adhesion between a negative film and a photosensitive layer to improve the plate makability, by laminating a cover film, the photosensitive layer provided through a specific adhesion preventing layer, and a supporting material in order from the top layer. CONSTITUTION:In a photosensitive resin laminated body for forming a solid relief mold where a cover film, a photosensitive layer, and a supporting material ae laminated in order from the top layer, an adhesion preventing layer which is soluble in the developer of the photosensitive layer and has a peeling strength to the photosensitive layer higher than that to the cover film by >=50g/cm and has >=30g/cm peeling strength to the cover film is interposed between the cover film and the photosensitive layer. In respect to materials constituting this adhesion preventing layer, materials having <=50cc/cm<2>.24hr.atm oxygen permeability out of cellulose, polyvinyl alcohol, polyacrylamide, etc. are desirable.
申请公布号 JPS5810734(A) 申请公布日期 1983.01.21
申请号 JP19810108464 申请日期 1981.07.10
申请人 TOYO BOSEKI KK 发明人 NANHEI MASARU;KOUDA HAJIME;FUJIMURA TOSHIAKI
分类号 G03F7/095;G03F7/00;G03F7/09;G03F7/11 主分类号 G03F7/095
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