| 摘要 |
PURPOSE:To improve the degree of integration by mutually arranging the first chip and the second chip having the relationship of mirror inversion with the first chip oppositely disposed and forming them in integral structure by a mold or ceramic. CONSTITUTION:The second chip 5 shaping an integrated circuit having the relationship of mirror inversion or interpolation with an integrated circuit formed to the chip 2 is connected to a frame 1 by wires 6. Accordingly, mutually common electrodes among electrodes formed onto each chip 2, 5 are opposed, the electrodes of the chips 2, 5 and the leads 1a of the frame 1 can easily be connected by the wires 3, 6, and mounting density is improved. |
