| 摘要 |
PURPOSE:To prevent the short circuit of a bonding wire by mounting an insulating supporting base supporting a conductor between a semiconductor chip and an external terminal. CONSTITUTION:The IC chip 4 is connected to the terminals 2 by the conductors, 3, and the conductors 3 are supported among the chip 4 and the terminals 2 by the insulating supporting bases 6. Consequently, the projections 5 of the edge end section of the chip generated when scribing a wafer do not contact with the conductors 3 because the angles 8 of the conductors 3 to the surface of the chip are increased, and the conductors and not deformed to physical stress because the conductors are supported by the insulating suppording bases. Accordingly, adjacent conductors are not mutually short-circuited. |
