| 摘要 |
PURPOSE:To prevent a resit film from being scratched during carrying in accordance with softening of the resist film, by blowing dried gas to the photoresist film formed on a substrate to blow off forcedly gaseous organic component, which is generated when a resist liquid is applied, to the outside of a vessel. CONSTITUTION:A semiconductor substrate 10 is put on and attracted to a rotary table 5, and a resist liquid is dropped from a nozzle 9 and the rotary table 5 is rotated to form a photoresist film 14 on one face of the substrate 10, and the substrate 10 is inverted to form the resist film 14 on the other face in the similar process. In this case, for the purpose of preventing photoresist films 14 from being softened by gaseous organic component filled up in a vessel 2, gaseous N2 or the lie is blown to the semiconductor substrate 10 from an injection nozzle 12 to blow off gaseous organic component, and hardening of softened photoresist films 14 is accelerated, thus preventing photoresist films from being scratched when they are carried to the next process. |
