发明名称 CUTTING METHOD BY LASER
摘要 PURPOSE:To cut a small aquare hole of good dimensional accuracy by sticking a metallic plate having a specified through hole fast to a material to be worked and performing laser cutting. CONSTITUTION:Metallic plates 5 having through holes which are similar in shape with the hole to be cut in a material to be worked 2 are sttuck fast to the upper and rear surfaces of the material 2, and irradiated by an oscillated laser beam 1. The laser beam is oscillated in the through holes of the metallic plates 5 with locus 7 to perform laser cutting. When laser cutting of a small square hole is performed, thermally influenced part around cut part becomes remarkably small as the circumference of the cut part is sheltered by the metallic plates 5 having sufficient heat capacity and dimensional accuracy of cutting can be fully maintained.
申请公布号 JPS589782(A) 申请公布日期 1983.01.20
申请号 JP19810105556 申请日期 1981.07.08
申请人 KOGYO GIJUTSUIN (JAPAN) 发明人 KOBAYASHI MINORU;HOSHINOUCHI SUSUMU;KANEKO MASAYUKI
分类号 B23K26/00;B23K26/06;B23K26/18;B23K26/38 主分类号 B23K26/00
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