MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To stick firmly, by bonding aluminum on the back of a semiconductor chip and Ni or Sn on the stem or frame surface, contacting face to face, and applying ultrasonic vibration to the chip. CONSTITUTION:A Ni-plated layer 4 on a stem or frame and an aluminum-evaporated layer are contacted face to face. A chip 2 is given ultrasonic vibration and sticked firmly. This method unnecessitate a heating process at high temperatures, gives no adverse influence on a semiconductor device and no oxidation on the stem or frame, and simplifies the device. Unnecessity of Au reduces the cost in production.