Tape automated bonding for integrated circuits.

摘要

A technique is disclosed for protecting integrated circuits from alpha particles. A central portion of a radiation resistant insulating substrate upon which electrically conductive leads are disposed is positioned in proximity to the integrated circuit. When the leads are electrically connected to the integrated circuit, the central portion of the substrate is allowed to remain over the integrated circuit to protect the integrated circuit. The insulating substate typically comprises a polyimide film resistant to alpha particles.