| 摘要 |
PURPOSE:To obtain a small-sized, easily-manufactured and thin-film coil device by insulating adjacent thin-film coils from each other, and making them overlap with each other at multiple-winding dormation parts. CONSTITUTION:A coil 3 has plural lead parts 7 formed on a substrate 1 as one coil terminal. On them, couples of conductor thin-film C and I-shaped patterns 41 are formed in such a way that parts (e) and (f) overlap with each other. On the patterns, G-shaped insulating layer patterns 51 are adhered so that only the parts (g) of the C-shaped patterns and the parts (f) of the I-shaped patterns are exposed. Then, couples of conductor thin-film I and C-shaped patterns 42 are formed so that parts (h) of the I-shaped patterns are connected to the parts (g) of the C-shaped patterns and the parts (i) of the C-shaped patterns are connected to the parts (f) of the I-shaped patterns. On them, insulating layer patterns 52 are formed in such a way that the parts (j) of the I-shaped patterns and the parts (k) of the C-shaped patterns are exposed. Those operations are repeated to obtain a small-sized, easily-manufactured coil device. |
