发明名称 BONDING METHOD
摘要 PURPOSE:To improve workability, by detecting a metal fine-wire end drawing out of a capillary end after cutoff, vibrating the fine-wire by a detecting signal, and drawing out to form a ball. CONSTITUTION:A capillary 4 and a clamp 5 are drawn up to a designated position after connecting a wire 6 to the second junction region 7a. Junction regions 7a, 3a and a semiconductor chip 3 are electrified through the wire 6. The wire 6 further than the junction is checked for cracks. When there is a defect and the wire 6 is cut off at the next process, the wire end goes into the capillary and no ball is formed at the end. In such a condition, the clamp 5 is given ultrasonic vibration, and the wire 6 contained between the clamp 5 and capillary 4 is drawn out to a designated length. A ball 6a is made at its end by hydrogen burner 8. This constitution enhances the workability, becuase the ball is formed rapidly to transfer to the next process even if there is a defect at the wire at locations further than the junction.
申请公布号 JPS589330(A) 申请公布日期 1983.01.19
申请号 JP19810106505 申请日期 1981.07.08
申请人 TOKYO SHIBAURA DENKI KK 发明人 MIYAJIMA KENJI
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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