发明名称 ELECTROCONDUCTIVE INJECTION MOLDING METHOD OF RESIN PART
摘要 PURPOSE:To form an electroconductive layer of good adherence entirely on a surface and a back of a molded resin parts readily, by applying an electroconductive substance in advance to a surface of a mold cavity. CONSTITUTION:A wax releasing agent 3 is applied on a cavity surface of an upper mold 1 and a lower mold 2 and an electroconductive liquid covering material (a mixture of carbon fiber, metal powder etc. and the same resin as a molding resin) 4 is sprayed. A resin is injected in the mold and a resin molded product 6 is molded. The releasing agent 3 is washed and removed. The injection molded electroconductive product 6 is placed on an fixing jig 7 and a uniformly applied film is shaped by electrostatic coating with an electrostatic spray gun 8.
申请公布号 JPS588623(A) 申请公布日期 1983.01.18
申请号 JP19810107755 申请日期 1981.07.10
申请人 TOYOTA JIDOSHA KOGYO KK 发明人 MASUYAMA TAKAYUKI;FUKUDA KENJI;SHISHIKURA KAZUO
分类号 B29C35/00;B29C45/00;B29C45/14;(IPC1-7):29F1/00 主分类号 B29C35/00
代理机构 代理人
主权项
地址