发明名称 |
ELECTROCONDUCTIVE INJECTION MOLDING METHOD OF RESIN PART |
摘要 |
PURPOSE:To form an electroconductive layer of good adherence entirely on a surface and a back of a molded resin parts readily, by applying an electroconductive substance in advance to a surface of a mold cavity. CONSTITUTION:A wax releasing agent 3 is applied on a cavity surface of an upper mold 1 and a lower mold 2 and an electroconductive liquid covering material (a mixture of carbon fiber, metal powder etc. and the same resin as a molding resin) 4 is sprayed. A resin is injected in the mold and a resin molded product 6 is molded. The releasing agent 3 is washed and removed. The injection molded electroconductive product 6 is placed on an fixing jig 7 and a uniformly applied film is shaped by electrostatic coating with an electrostatic spray gun 8. |
申请公布号 |
JPS588623(A) |
申请公布日期 |
1983.01.18 |
申请号 |
JP19810107755 |
申请日期 |
1981.07.10 |
申请人 |
TOYOTA JIDOSHA KOGYO KK |
发明人 |
MASUYAMA TAKAYUKI;FUKUDA KENJI;SHISHIKURA KAZUO |
分类号 |
B29C35/00;B29C45/00;B29C45/14;(IPC1-7):29F1/00 |
主分类号 |
B29C35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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