INFORMATIONSKARTE MIT INTEGRIERTEM BAUSTEIN

摘要

1. A method of manufacturing contact elements provided on connection surfaces of an integrated circuit element to be arranged more particularly within an information card, which contact elements serve for contacting with conductor tracks carried by a foil and are first manufactured with a spherical surface and are then flattened to the same height, characterized in that the individual contact elements are first preformed by spherical melting of the end of a wire formed from a conductive material, are then connected to the connection surfaces under high pressure and flattened to a given height and are finally severed from the wire.