MEJORAS A PAQUETE SEMICONDUCTOR SELLADO HERMETICAMENTE CON UNA CAMARA DE REFUERZO Y SELLAMIENTO

摘要

A semiconductor device is described wherein a semiconductor pellet is disposed within a hermetically sealed chamber including a thermally conductive base and a substantially rigid housing, said housing including an open upper chamber in which are disposed electrical terminals and which is filled with a sealing and strengthening layer to substantially increase the strength and hermeticity of the package.