| 摘要 |
<p>PURPOSE:To reduce parasitic capacity and to make a device small-sized, by forming a recessed groove between conductive patterns which are adjacent to each other and in each different potential relation, and also, electrically shielding the part between the adjacent conductive patterns in the recessed groove. CONSTITUTION:On the surface of an insulating substrate 1 placed between conductive patterns 2', 2'', and 2', 2''', respectively, a recessed groove 6 is formed. Also, in the recessed groove 6, a shielding electric conductor layer 7 is provided, to which, for instance, the ground potential of the reverse side is provided through a through-hole 8 which passes through the substrate 1. Electrostatic capacity between the conductive patterns 2', 2'', and 2', 2''' is reduced since the inside of the recessed groove 6 is air, and accordingly, the electrostatic capacity between the conductive patterns can be reduced sufficiently.</p> |
