发明名称 MANUFACTURE OF ELECTRONIC DEVICE
摘要 PURPOSE:To simplify the assembling of the titled device by a method wherein a lead and an electron element are provided on a flange, heat is conducted to the lead by heating the flange, and a wire is connected to the lead. CONSTITUTION:A groove 7, wherein slits 2 and 4, a protrusion 5, a bolt hole 3 and the position 8 of the element are provided as prescribed, is formed and Ni plating is performed. The electron element 13 is electric welded to the position 8 through the intermediary of silver foil 10 using Au-Si eutectic soldering material 14. On the other hand, an inner lead 21a, a slit hole 24 and a tab lead 25b, which will be provided at the fixed relational position with the lead 21a, and an outer lead 21b are formed by processing a thin plate of phosphor-bronze and the like, and silver plating is performed. The point of a tab lead 25a is inserted in the center of a pair of holes 4 of the flange 1 and fixed by caulking using the protrusion 5. Then, the flange 1 is placed on a base 34, and a gold wire 32 is thermo-press welded to the lead 21a through the intermediary of a spacer 33. Lastly, resin sealing 37 is performed and the device is completed. According to this constitution, the assembling work can be simplified, the molding mold is not complicated and this method of manufacture is proved to be fitted for industrialization.
申请公布号 JPS584961(A) 申请公布日期 1983.01.12
申请号 JP19820096168 申请日期 1982.06.07
申请人 HITACHI SEISAKUSHO KK 发明人 SUZUKI JINICHIROU;TAKEZAWA KENJI;TAKEDA TAKANORI
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址